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HYSOL PUBLISHED LIBRARY:USE KEYBOARD ARROWS TO SCAN DOCUMENTS EASILYarrows

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Hysol offers a full line of adhesives, conformal coatings, and encapsulants with fast-setting to high tempature properties. When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol line of products is without compare.

Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.

The Hysol line of products also complies with the latest environmental legislation, delivering “Green” and lead-free compatible materials as the industry moves toward more environmentally-friendly manufacturing.

 

 

List of HYSOL Public Library
pdf icon smallHysol Aerospace Selector Guide.pdf
pdf icon smallHysol high temp potting ES 9820 – EA 9825.pdf
pdf icon smallHysol products selector guide for aerospace.pdf
pdf icon smallHysol Electronic coating powders.pdf
pdf icon smallHysol Electronic Solutions 1.pdf
pdf icon smallHysol Electronic Solutions 2.pdf
pdf icon smallHysol Electronic Assembly Guide.pdf
pdf icon smallHysol Surface Prep.pdf